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Logo: Institute of Microelectronic Systems
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Hearing4All

Supervisor:Prof. Dr.-Ing. H. Blume, Jun.-Prof. Dr.-Ing. G. Payá-Vayá
Researcher:M.Sc. C. Seifert, Dipl.-Ing. L. Gerlach
Duration:November 2012 - December 2018

Bild Hearing4All

Processor Architectures for Hearing Aids

The joint venture "Hearing4all" that the IMS-AS participates in with multiple sub-projects, has been chosen as one of the federal cluster of excellence projects Friday June 15th 2012.

The project will be funded with 34 million euro for a period of five years.

In charge of the project is the University of Oldenburg, which has filed the successful application together with the Hannover Medical School and the Leibniz Universität Hannover.

Purpose of the interdisciplinary five-year joint venture is in fact "hearing for all". 18 percent of the German population - with more than 50 percent of the more than 65-year-olds - suffer from hearing loss requiring treatment. Scientists strive to improve communication circumstances of the concerned persons significantly - be it at work, in traffic or at home. Key enablers are advances in personalized hearing diagnostics and the hereupon adapted treatment with personal hearing aids.

In the scope of this interdisciplinary project the IMS-AS aims to develop high-performance and low-power processor architectures for digital hearing systems, such as cochlear implants or hearing aids.

The goals of the federal cluster of excellence are presented in this video

Publications

Payá-Vayá, G.; Seifert, C.; Blume, H. (2013): Design of Application-Specific Instruction-Set Processors for Digital Hearing Aid Systems, 1st Russian German Conference on Biomedical Engineering (RGC 2013), Proceedings of 1st Russian German Conference on Biomedical Engineering (RGC 2013), B. Chichkov, E. Fadeeva, L.A. Kahrs, T. Ortmaier, PZH Verlag (32)

Payá-Vayá, G.; Seifert, C.; Blume, H. (2013): Application-Specific Instruction-Set Processors for Ultra-Low-Power Hearing Aid Devices, 26th International System-on-Chip Conference (SOCC 2013) (invited poster and demo presentation)

Payá-Vayá, G. (2013): ASIP-Architekturen für digitale Hörgerätesysteme – Ergebnisse aus dem Exzellenzcluster Hearing4all, DESIGN&ELEKTRONIK-Entwicklerforum "Electronics goes medical", Tagunsunterlagen DESIGN&ELEKTRONIK-Entwicklerforum "Electronics goes medical"

Seifert, C.; Payá-Vayá, G.; Blume, H. (2013): A Multi-Channel Audio Extension Board for Binaural Hearing Aid Systems, Conference ICT.OPEN 2013, Proceedings of ICT.OPEN 2013, (33--37)

Werner, N.; Payá-Vayá, G.; Blume, H. (2013): Case Study: Using the Xtensa LX4 Configurable Processor for Hearing Aid Applications, Conference ICT.OPEN 2013, Proceedings of ICT.OPEN 2013, (27-32)

Hartig, J.; Gerlach, L.; Payá-Vayá, G.; Blume, H. (2014): Customizing a VLIW-SIMD Application-Specific Instruction-Set Processor for Hearing Aid Devices, IEEE International Workshop on Signal Processing Systems 2014 (SiPS), Belfast, UK

Gerlach, L.; Payá Vayá, G.; Blume, H. (2015): FPGA-Based Rapid Prototyping for Exploring and Optimizing Hearing Aid Processors, 10th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2015), Bremen, Germany

Gerlach, L.; Payá Vayá, G.; Blume, H. (2015): An Area Efficient Real- and Complex-Valued Multiply-Accumulate SIMD Unit for Digital Signal Processors, 2015 IEEE Workshop on Signal Processing Systems, Hangzhou, China

Seifert, C.; Payá-Vayá, G.; Blume, H.;Herzke, T.;Hohmann, V. (2015): A Mobile SoC-Based Platform for Evaluating Hearing Aid Algorithms and Architectures, Consumer Electronics - Berlin (ICCE-Berlin), 2015 5th IEEE International Conference on

Weihs, C.; Jannach, D.; Vatolkin, I.; Rudolph, G.: Blume, H. ; et al. (2016): Music Data Analysis: Foundations and Applications, Chapman and Hall/CRC

Gerlach, L.; Nolting, S.; Blume, H.; Payá Vayá, G.; Stolberg, H.; Reuter, C. (2016): A Highly Optimized Arithmetic Software Library and Hardware Co-processor IP for Fixed-Point VLIW-SIMD Processor Architectures, Technology Transfer in Computing Systems (TETRACOM Technology Transfer Project (TTP), 2016), Prague, Czech Republic

Gerlach, L.; Payá-Vayá, G.; Blume, H. (2016): A Low Latency Multichannel Audio Interface for Low Power SIMD Digital Signal Processors, ICT.OPEN2016, Amersfoort, Netherlands (accepted for publication)

Gerlach, L.; Seifert, C.; Payá-Vayá, G.; Blume, H. (2016): Instruction-Set Extension based on a 2D Sound Source Localization Algorithm on a Low Power Hearing Aid System, Tensilica Day—Trends in Modern Design of Configurable Processors 2016, Hannover, Germany

Gerlach, L.; Payá Vayá, G.; Blume, H. (2016): Efficient Emulation of Floating-Point Arithmetic on Fixed-Point SIMD Processors, 2016 IEEE International Workshop on Signal Processing Systems (SiPS), Dallas, United States

Meyer, B. T.; Mallidi, S. H.; Castro Martínez, A. M.; Payá-Vayá, G.; Kayser, H.; Hermansky, H. (2016): Performance Monitoring for Automatic Speech Recognition in Noisy Multi-Channel Environments, 2016 IEEE Spoken Language Technology Workshop (SLT)

Seifert, C.; Thiemann, J.; Gerlach, L.; Volkmar, T.; Payá-Vayá, G.; Blume, H.; van de Par, S. (2017): Real-Time Implementation of a GMM-Based Binaural Localization Algorithm on a VLIW-SIMD Processor, International Conference on Multimedia and Expo (ICME) 2017, IEEE

Gerlach, L.; Marquardt, D.; Payá Vayá, G.; Liu, S.; Weißbrich, M.; Doclo, S.; Blume, H. (2017): Analyzing the Trade-Off between Power Consumption and Beamforming Algorithm Performance using a Hearing Aid ASIP, Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS), 2017 International Conference on, IEEE, Pythagorion, Greece

Gerlach, L.; Payá-Vayá, G.; Blume, H. (2018): Analyzing the Trade-Off between Power Consumption and Beamforming Algorithm Performance using a Hearing Aid ASIP, Tensilica Day—Trends in Modern Design of Configurable Processors 2018, Hannover, Germany

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