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Hein V, Weide-Zaage K, Clausner A. The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications. in 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.23919/PanPacific60013.2024.10436520
Weide-Zaage K. Dna Digital-storage: Advantages, Approach and Technical Implementation. in 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.23919/PanPacific60013.2024.10436508
Weide-Zaage K, Huang Y. Simulation of Thermal–Electrical and Mechanical Behavior of Conductive Yarns. Engineering Proceedings. 2024 Jan 18;52(1):17. doi: 10.3390/engproc2023052017
Thieu GB, Schmechel J, Weide-Zaage K, Schmidt K, Hagenah D, Paya-Vaya G. A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc. 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems). doi: 10.1109/EuroSimE56861.2023.10100757
Trumann E, Thieu GB, Schmechel J, Weide-Zaage K, Schmidt K, Hagenah D et al. Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. in Palumbo F, Keramidas G, Voros N, Diniz PC, Hrsg., Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Springer Science and Business Media Deutschland GmbH. 2023. S. 357-360. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)). doi: 10.1007/978-3-031-42921-7_24
Hollstein K, Entholzner D, Zhu G, Weide-Zaage K, Benstetter G. Developing a micro-thermography system for thermal characterization of LED packages. Microelectronic engineering. 2022 Feb 1;254:111694. Epub 2021 Dez 24. doi: 10.1016/j.mee.2021.111694
Weide-Zaage K, Paya-Vaya G, Schmidt K, Hagenah D. Investigation of FPGA and SRAM Cells under Radiation Exposure. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758864
Hein V, Weide-Zaage K. The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc. 2021. 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). doi: 10.1109/EuroSimE52062.2021.9410880
Hollstein K, Yang X, Weide-Zaage K. Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. Microelectronics reliability. 2021 Mai;120:114118. Epub 2021 Apr 17. doi: 10.1016/j.microrel.2021.114118
Hollstein K, Weide-Zaage K. Advances in Packaging for Emerging Technologies. in 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9059539 doi: 10.23919/panpacific48324.2020.9059539
Hollstein K, Yang L, Gao Y, Weide-Zaage K. Identification of influencing PCB design parameters on thermal performance of a QFN package. in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9152651 doi: 10.1109/eurosime48426.2020.9152651
Hollstein K, Weide-Zaage K. Silicon Die Bonding using a Photostructurable Adhesive Material. in 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9375868 doi: 10.23919/IWLPC52010.2020.9375868
Hein V, Weide-Zaage K, Yang X. Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8724562 doi: 10.1109/eurosime.2019.8724562
Weide-Zaage K, Guedon-Gracia A, Fremont H. Electromigration effects in corroded BGA. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8724522 doi: 10.1109/eurosime.2019.8724522
Weide-Zaage K. New-Automotive -Autonomous Driving Challenges For The Microelectronic Components. in 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8696273 doi: 10.23919/panpacific.2019.8696273
Weide-Zaage K, Paya-Vaya G, Eichin P. Simulations in terms of radiation effects on different BEOL material systems. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8724581 doi: 10.1109/eurosime.2019.8724581
Chatterjee A, Bai T, Edler F, Tegenkamp C, Weide-Zaage K, Pfnür H. Electromigration and morphological changes in Ag nanostructures. Journal of Physics Condensed Matter. 2018 Jan 31;30(8):084002. doi: 10.1088/1361-648x/aaa80a
Weide-Zaage K, Fremont H, Hein V. 'New automotive' - Considerations for reliability, robustness and resilience for CMOS interconnects. in 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-6. (2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018). doi: 10.23919/panpacific.2018.8318993
Weide-Zaage K, Hein V. Process, geometry and stack related reliability of thick ALCU-metal-tracks. in 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-7 doi: 10.23919/panpacific.2018.8319008
Weide-Zaage K, Tan Y, Hein V. Thick AlCu-metal reliability characterization. in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-4 doi: 10.1109/eurosime.2018.8369904
