Hollstein K, Yang X, Weide-Zaage K. Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. Microelectronics reliability. 2021 Mai;120. 114118. doi.org/10.1016/j.microrel.2021.114118
Hollstein K, Weide-Zaage K. Advances in Packaging for Emerging Technologies. in 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9059539 doi.org/10.23919/panpacific48324.2020.9059539
Hollstein K, Yang L, Gao Y, Weide-Zaage K. Identification of influencing PCB design parameters on thermal performance of a QFN package. in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9152651 doi.org/10.1109/eurosime48426.2020.9152651
Hollstein K, Weide-Zaage K. Silicon Die Bonding using a Photostructurable Adhesive Material. in 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9375868 doi.org/10.23919/IWLPC52010.2020.9375868
Hein V, Weide-Zaage K, Yang X. Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8724562 doi.org/10.1109/eurosime.2019.8724562
Weide-Zaage K, Guedon-Gracia A, Fremont H. Electromigration effects in corroded BGA. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8724522 doi.org/10.1109/eurosime.2019.8724522
Weide-Zaage K. New-Automotive -Autonomous Driving Challenges For The Microelectronic Components. in 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8696273 doi.org/10.23919/panpacific.2019.8696273
Weide-Zaage K, Paya-Vaya G, Eichin P. Simulations in terms of radiation effects on different BEOL material systems. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8724581 doi.org/10.1109/eurosime.2019.8724581
Chatterjee A, Bai T, Edler F, Tegenkamp C, Weide-Zaage K, Pfnür H. Electromigration and morphological changes in Ag nanostructures. Journal of Physics Condensed Matter. 2018 Jan 31;30(8). 084002. doi.org/10.1088/1361-648x/aaa80a
Weide-Zaage K, Fremont H, Hein V. 'New automotive' - Considerations for reliability, robustness and resilience for CMOS interconnects. in 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-6. (2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018). doi.org/10.23919/panpacific.2018.8318993
Weide-Zaage K, Hein V. Process, geometry and stack related reliability of thick ALCU-metal-tracks. in 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-7 doi.org/10.23919/panpacific.2018.8319008
Weide-Zaage K, Tan Y, Hein V. Thick AlCu-metal reliability characterization. in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc. 2018. S. 1-4 doi.org/10.1109/eurosime.2018.8369904
Pohl M, Erstling M, Hein V, Weide-Zaage K, Chen T. Differences in reliability effects for thick copper and thick aluminium metallizations. in 2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. S. MR2.1-MR2.7. 7936377. (IEEE International Reliability Physics Symposium Proceedings). doi.org/10.1109/irps.2017.7936377
Sethu RS, Hein V, Erstling M, Weide-Zaage K. Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks. in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7926226 doi.org/10.1109/eurosime.2017.7926226
Weide-Zaage K, Payá-Vayá G. COTS - Harsh condition effects considerations from technology to user level. Advances in Science, Technology and Engineering Systems. 2017;2(3):1592-1598. doi.org/10.25046/aj0203198
Weide-Zaage K, Eichin P, Chen C, Zhao Y, Zhao L. COTS-radiation effects approaches and considerations. in 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7859581. (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).
Weide-Zaage K. Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). Microelectronics reliability. 2017 Sep;76-77:6-12. doi.org/10.1016/j.microrel.2017.07.026
Weide-Zaage K, Fremont H, Guedon-Gracia A, Feng Y, Chen A. Study of Corrosion in BGA solder balls. 2017. Beitrag in Joint European Corrosion Congress 2017, EUROCORR 2017 and 20th International Corrosion Congress and Process Safety Congress 2017, Prague, Tschechische Republik.
Chrzanowska-Jeske M, Weide-Zaage K. Preface. in Semiconductor Devices in Harsh Conditions. CRC Press. 2016. S. xiii-xvii doi.org/10.1201/9781315368948
Guedon-Gracia A, Fremont H, Deletage JY, Weide-Zaage K. Corrosion study on BGA assemblies. in 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7428402 doi.org/10.1109/panpacific.2016.7428402
