Forschung
Publikationen

Publikationen des Instituts für Mikroelektronische Systeme


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2021


Session 33 Overview : High-Voltage, GaN and Wireless Power. / Chen, Min; Wicht, Bernhard; Miyaji, Kousuke.

2021 IEEE International Conference on Solid-State Circuits: Digest of Technical Papers. Vol. 64 First Edition. ed. 2021. p. 458-459 (Digest of Technical Papers - IEEE International Solid State Circuits Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review

The Bose-Einstein Condensate and Cold Atom Laboratory. / Frye, Kai; Abend, Sven; Bartosch, Wolfgang; Bawamia, Ahmad; Becker, Dennis; Blume, Holger; Braxmaier, Claus; Chiow, Sheng-Wey; Efremov, Maxim A.; Ertmer, Wolfgang; Fierlinger, Peter; Gaaloul, Naceur; Grosse, Jens; Grzeschik, Christoph; Hellmig, Ortwin; Henderson, Victoria A.; Herr, Waldemar; Israelsson, Ulf; Kohel, James; Krutzik, Markus; Kürbis, Christian; Lämmerzahl, Claus; List, Meike; Lüdtke, Daniel; Lundblad, Nathan; Marburger, J. Pierre; Meister, Matthias; Mihm, Moritz; Müller, Holger; Müntinga, Hauke; Oberschulte, Tim; Papakonstantinou, Alexandros; Perovšek, Jaka; Peters, Achim; Prat, Arnau; Rasel, Ernst M.; Roura, Albert; Schleich, Wolfgang P.; Schubert, Christian; Seidel, Stephan T.; Sommer, Jan; Spindeldreier, Christian; Stamper-Kurn, Dan; Stuhl, Benjamin K.; Warner, Marvin; Wendrich, Thijs; Wenzlawski, André; Wicht, Andreas; Windpassinger, Patrick; Yu, Nan; Wörner, Lisa.

In: EPJ Quantum Technology, Vol. 8, No. 1, 1, 04.01.2021.

Research output: Contribution to journalArticleResearch

A Survey on Application Specific Processor Architectures for Digital Hearing Aids. / Gerlach, Lukas Konrad; Payá Vayá, Guillermo; Blume, Holger Christoph.

In: Journal of Signal Processing Systems, 20.03.2021.

Research output: Contribution to journalArticleResearchpeer review

KAVUAKA: A Low-Power Application-Specific Processor Architecture for Digital Hearing Aids. / Gerlach, Lukas Konrad.

2021.

Research output: ThesisDoctoral thesis

Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. / Hollstein, K.; Yang, X.; Weide-Zaage, K.

In: Microelectronics reliability, Vol. 120, 114118, 05.2021.

Research output: Contribution to journalArticleResearchpeer review

Automated abstraction of nonlinear analog circuits to reliable set-valued models with reduced overapproximation. / Rechmal-Lesse, Malgorzata; Adhisantoso, Yeremia Gunawan; Koroa, Gerald Alexander; Olbrich, Markus.

In: Microelectronics Reliability, Vol. 121, 114119, 06.2021.

Research output: Contribution to journalArticleResearchpeer review

Integrated Hybrid Resonant DCDC Converters. / Renz, Peter Marius; Wicht, Bernhard.

Springer, 2021.

Research output: Book/ReportMonographResearchpeer review

Highly Integrated Gate Drivers for Si and GaN Power Transistors. / Seidel, Achim; Wicht, Bernhard.

Springer Nature, 2021.

Research output: Book/ReportMonographResearchpeer review

Measuring vertical jump height using a smartphone camera with simultaneous gravity-based calibration. / Webering, Fritz; Seeger, Leo; Rother, Niklas; Blume, Holger Christoph.

2021. Paper presented at IEEE International Conference on Consumer Electronics 2021, .

Research output: Contribution to conferencePaperResearchpeer review


2020


Multicore performance prediction with MPET : Using scalability characteristics for statistical cross-architecture prediction. / Arndt, Oliver Jakob; Lüders, Matthias; Riggers, Christoph; Blume, Holger.

In: Journal of Signal Processing Systems, Vol. 92, No. 9, 01.07.2020, p. 981-998.

Research output: Contribution to journalArticleResearchpeer review

Psychophysics Study on LED Flicker Artefacts for Automotive Digital Mirror Replacement Systems. / Behmann, Nicolai; Blume, Holger.

In: IS and T International Symposium on Electronic Imaging Science and Technology, Vol. 2020, No. 11, 234, 26.01.2020.

Research output: Contribution to journalConference articleResearchpeer review

KAVUAKA : Chip Design für digitale Hörhilfen. / Blume, Holger Christoph; Payá Vayá, Guillermo; Gerlach, Lukas Konrad.

In: Unimagazin : Forschungsmagazin der Leibniz-Universität Hannover, Vol. 2020, No. 1, 2020, p. 18-20.

Research output: Contribution to journalArticleResearch

SmartHeaP - Smart Hearing Aid Processor - Ein industrielles Translationsprojekt für digitale Hörhilfen. / Blume, Holger Christoph; Payá Vayá, Guillermo; Karrenbauer, Jens Christian; Benndorf, Jens; Blawat, Meinolf.

In: Unimagazin : Forschungsmagazin der Leibniz-Universität Hannover, 01.2020.

Research output: Contribution to journalArticleResearch

Issue-slot based predication encoding technique for vliw processors. / Gerlach, Lukas; Stuckmann, Fabian; Blume, Holger; Paya-Vaya, Guillermo.

2020 9th International Conference on Modern Circuits and Systems Technologies, MOCAST 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9200304.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review

Evaluation of Different Processor Architecture Organizations for On-Site Electronics in Harsh Environments. / Gesper, Sven; Weissbrich, Moritz; Stuckenberg, Tobias; Jaaskelainen, Pekka; Blume, Holger; Paya-Vaya, Guillermo.

In: International Journal of Parallel Programming, 26.12.2020.

Research output: Contribution to journalArticleResearchpeer review

Evolutionary Algorithms for Instruction Scheduling, Operation Merging, and Register Allocation in VLIW Compilers. / Giesemann, F.; Gerlach, L.; Payá-Vayá, G.

In: Journal of Signal Processing Systems, Vol. 92, No. 7, 17.01.2020, p. 655-678.

Research output: Contribution to journalArticleResearchpeer review

Advances in Packaging for Emerging Technologies. / Hollstein, Kai; Weide-Zaage, Kirsten.

2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059539.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review

Identification of influencing PCB design parameters on thermal performance of a QFN package. / Hollstein, Kai; Yang, Lintao; Gao, Yuan; Weide-Zaage, Kirsten.

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9152651.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review

Silicon Die Bonding using a Photostructurable Adhesive Material. / Hollstein, Kai; Weide-Zaage, Kirsten.

2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9375868.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review

Design Space Exploration Framework for Tensilica-Based Digital Audio Processors in Hearing AIDS. / Karrenbauer, Jens; Gerlach, Lukas; Paya-Vaya, Guillermo; Blume, Holger.

2020 9th International Conference on Modern Circuits and Systems Technologies, MOCAST 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9200250 (2020 9th International Conference on Modern Circuits and Systems Technologies, MOCAST 2020).

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer review


Showing entries 1 - 20 out of 372
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