Advances in Packaging for Emerging Technologies

authored by: Kai Hollstein, Kirsten Weide-Zaage
Abstract: A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Starting with a description about the trends in miniaturization of IC packaging and the demand for heterogeneous integration in the following a focus on commonly applied processes like System-on-Chip, Flip-Chip packaging, Fan-out packaging and 3D-Integration will be presented. A brief explanation about process characteristics, followed by an explanation of the main process steps is described. The latest version of the heterogeneous integration roadmap is short introduced. The link to corresponding fields of application like high performance computing and AI processing, mobile electronics and 5G, and automotive is given. Here, main requirements for each technological sectors are worked out followed by a description of commonly applied package types. Each sector is round up by mentioning key challenges for future developments.
Organisation(s): Institute of Microelectronic Systems
Type: Conference contribution
Publication date: 2020
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Safety, Risk, Reliability and Quality
Electronic version(s): https://doi.org/10.23919/panpacific48324.2020.9059539 (Access: Closed)