apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
Adresse
Appelstr. 4
30167 Hannover
Gebäude
Raum
220
Adresse
Appelstr. 4
30167 Hannover
Gebäude
Raum
220
  • Publikationsliste

    Zeige Ergebnisse 1 - 20 von 101

    2023


    A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. / Thieu, Gia Bao; Schmechel, Johannes; Weide-Zaage, Kirsten et al.
    2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. / Trumann, Eike; Thieu, Gia Bao; Schmechel, Johannes et al.
    Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Hrsg. / Francesca Palumbo; Georgios Keramidas; Nikolaos Voros; Pedro C. Diniz. Springer Science and Business Media Deutschland GmbH, 2023. S. 357-360 (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 14251 LNCS).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


    2022


    Developing a micro-thermography system for thermal characterization of LED packages. / Hollstein, K.; Entholzner, D.; Zhu, G. et al.
    in: Microelectronic engineering, Jahrgang 254, 111694, 01.02.2022.

    Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

    Investigation of FPGA and SRAM Cells under Radiation Exposure. / Weide-Zaage, Kirsten; Paya-Vaya, Guillermo; Schmidt, Katharina et al.
    2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


    2021


    The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts. / Hein, Verena; Weide-Zaage, Kirsten.
    2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 2021. 9410880 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. / Hollstein, K.; Yang, X.; Weide-Zaage, K.
    in: Microelectronics reliability, Jahrgang 120, 114118, 05.2021.

    Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review


    2020


    Advances in Packaging for Emerging Technologies. / Hollstein, Kai; Weide-Zaage, Kirsten.
    2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059539.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Identification of influencing PCB design parameters on thermal performance of a QFN package. / Hollstein, Kai; Yang, Lintao; Gao, Yuan et al.
    2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9152651.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Silicon Die Bonding using a Photostructurable Adhesive Material. / Hollstein, Kai; Weide-Zaage, Kirsten.
    2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9375868.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


    2019


    Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution. / Hein, Verena; Weide-Zaage, Kirsten; Yang, Xi.
    2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724562.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Electromigration effects in corroded BGA. / Weide-Zaage, Kirsten; Guedon-Gracia, Alexandrine; Fremont, Helene.
    2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724522.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    New-Automotive -Autonomous Driving Challenges For The Microelectronic Components. / Weide-Zaage, Kirsten.
    2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8696273.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Simulations in terms of radiation effects on different BEOL material systems. / Weide-Zaage, Kirsten; Paya-Vaya, Guillermo; Eichin, Philemon.
    2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724581.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


    2018


    Electromigration and morphological changes in Ag nanostructures. / Chatterjee, Atasi; Bai, Tianjin; Edler, Frederik et al.
    in: Journal of Physics Condensed Matter, Jahrgang 30, Nr. 8, 084002, 31.01.2018.

    Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

    'New automotive' - Considerations for reliability, robustness and resilience for CMOS interconnects. / Weide-Zaage, Kirsten; Fremont, Helene; Hein, Verena.
    2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., 2018. S. 1-6 (2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018; Band 2018-January).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Process, geometry and stack related reliability of thick ALCU-metal-tracks. / Weide-Zaage, Kirsten; Hein, Verena.
    2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., 2018. S. 1-7.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Thick AlCu-metal reliability characterization. / Weide-Zaage, Kirsten; Tan, Yuqi; Hein, Verena.
    2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., 2018. S. 1-4.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


    2017


    Differences in reliability effects for thick copper and thick aluminium metallizations. / Pohl, Martin; Erstling, Marco; Hein, Verena et al.
    2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. S. MR2.1-MR2.7 7936377 (IEEE International Reliability Physics Symposium Proceedings).

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks. / Sethu, Raj Sekar; Hein, Verena; Erstling, Marco et al.
    2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7926226.

    Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

    COTS - Harsh condition effects considerations from technology to user level. / Weide-Zaage, Kirsten; Payá-Vayá, Guillermo.
    in: Advances in Science, Technology and Engineering Systems, Jahrgang 2, Nr. 3, 2017, S. 1592-1598.

    Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review


  • Forschungsprojekte

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