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Logo: Institut für Mikroelektronische Systeme
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Publikationen von apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Bücher

2016

Weide-Zaage, K. (Ed.); Chrzanowska-Jeske, M. (Ed.) (2016): Semiconductor-Devices-in-Harsh-Conditions, CRC Press Tylor & Francis Group, Series: Devices, Circuits, and Systems
ISBN: ISBN 9781498743808 - CAT# K26860

1994

Weide, K. (1994): Untersuchung von Stromdichte-, Temperatur- und Massenflußverteilungen in Viastrukturen integrierter Schaltungen, Fortschrittberichte VDI / 9 Fortschrittberichte VDI Verein Deutscher Ingenieure VDI Verlag, Elektronik, Nr. 184
ISBN: 3-18-318409-5

Buchbeiträge

2012

Weide-Zaage, K.  (2012): The Finite Element Analysis of Weak Spots in Interconnects and Packages, Finite Element Analysis - New Trends and Developments, Dr. Farzad Ebrahimi (Ed.)
DOI: 10.5772/50779
ISBN: 978-953-51-0769-9

2009

Weide-Zaage, K. (2009): Finite Element Simulations of Metallization Structures for Reliability Prediction, Chemical Mineralogy, Smelting and Metallization, Nova Science Publishers, Ed. Eugene D. McLaughlin and Levan A. Breaux, Chapter 12, pp. 249-288
DOI:
ISBN: 978-1-60692-853-0

Journalbeiträge

2018

Chatterjee, A.; Bai, T.; Edler, F.; Tegenkamp, C.; Weide-Zaage, K.; Pfnür, H. (2018): Electromigration and morphological changes in Ag nanostructures, J. Phys.: Condens. Matter, Vol. 30, No.9
DOI: 10.1088/1361-648X/aaa80a

2017

Weide-Zaage, K. (2017): Simulation of Packaging under Harsh Environment Conditions (Temperature, Pressure, Corrosion and Radiation) , Microelectronics Reliability, Volume 76-77, September 2017
DOI: 10.1016/j.microrel.2017.07.026

Weide-Zaage, K.; Payá-Vayá, G. (2017): COTS – Harsh Condition Effects Considerations from Technology to User Level, Adv. Sci. Technol. Eng. Syst. J. 2(3), 1592-1598 (2017)
ISBN: ISSN: 2415-6698

2016

Guédon-Gracia, A.; Frémont, H.; Plano, B.; Delétage, J.-Y.; Weide-Zaage, K. (2016): Effects of salt spray test on lead-free solder alloy, Microelectronics Reliability, Volume 64, September 2016, Pages 242-247
DOI: 10.1016/j.microrel.2016.07.034

Hein, V.; Erstling, M.; Sekar Sethu, R.; Weide-Zaage, K.; Bai, T. (2016): Reliability Evaluation of Donut-Tungsten-Via as an Element of the Highly Robust Metallization , Microelectronics Reliability, Volume 64, September 2016, Pages 259–265
DOI: 10.1016/j.microrel.2016.07.136

2015

Meinshausen, L.; Frémont, H.; Weide-Zaage, K. (2015): Dynamical IMC-Growth Calculation, Microelectronics Reliability, Volume 55, Issues 9–10, August–September 2015, Pages 1832–1837
DOI: 10.1016/j.microrel.2015.06.052

Nordin, N. I. M.; Said, S. M.; Ramli, R.; Weide-Zaage, K.; Sabri, M. F. M.; Mamat, A.; Ibrahim, N. N. S.; Mainal, A.; Datta, R. S. (2015): Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder , RSC Advances, Issue 120
DOI: 10.1039/C5RA18453C

Sabri, M. F. M.; Nordin,N. I. M.; Said, S. M.; Amin, N. A. A. M.; Arof, H.; Jauhari, I.; Ramli, R.; Weide-Zaage,K. (2015): Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys, Microelectronics Reliability, Volume 55, Issues 9–10, August–September 2015, Pages 1882–1885
DOI: 10.1016/j.microrel.2015.06.123

Weide-Zaage, K.; Moujbani, A. (2015): Simulation of µ-Bump and TSV in 3D-Integration, International Journal of Engineering Practical Research (IJEPR), Volume 4, Issue 1 (April 2015)
DOI: ISSN Online: 2326-5922
ISBN: ISSN Print: 2326-5914

2014

Frémont, H.; Kludt, J.; Wade, M.; Weide-Zaage, K.; Bord-Majek, I.; Duchamp, G. (2014): Qualification procedure against moisture for embedded capacitors, Microelectronics Reliability, Volume 54, Issues 9–10, Pages 2013–2016
DOI: 10.1016/j.microrel.2014.07.117

Hein, V.; Kludt, J.; Weide-Zaage, K. (2014): Evaluation new Corner Stress Relief Structure Layout for high robust Metallization, Microelectronics Reliability, Volume 54, Issues 9–10, Pages 1977–1981
DOI: 10.1016/j.microrel.2014.07.039

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V.; Kovács, C. (2014): Degradation Behaviour in Upstream/ Downstream Via Test Structures, Microelectronics Reliability, Volume 54, Issues 9–10, Pages 1724–1728
DOI: 10.1016/j.microrel.2014.07.042

Meinshausen, L.; Frémont, H.; Weide-Zaage, K.; Plano, B. (2014): Electro- and Thermomigration Induced Cu3Sn and Cu6Sn5 Formation in SnAg3.0Cu0.5 Bumps, Microelectronics Reliability, Volume 53, Issues 9–11, Pages 1575–1580
DOI: 10.1016/j.microrel.2014.09.030

Rongen, R.; Roucou, R,; vd Wel, P.J.; Voogt, F.; Swartjes, F.; Weide-Zaage, K. (2014): Reliability of Wafer Level Chip Scale Packages, Microelectronics Reliability, Volume 54, Issues 9–10, Pages 1988-1994
DOI: 10.1016/j.microrel.2014.07.012

Weide-Zaage, K.; Schlobohm, J.; Rongen, R.T.H.; Voogt, F.C.; Roucou, R. (2014): Simulation and Measurement of the Flip Chip Solder Bumps with a Cu-plated plastic Core, Microelectronics Reliability, Volume 54, Issues 6–7, Pages 1206–1211
DOI: 10.1016/j.microrel.2014.02.021

2013

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2013): Dynamic simulation of octahedron slotted metal structures, Microelectronics Reliability, Volume 53, Issues 9–11, Pages 1606–1610
DOI: 10.1016/j.microrel.2013.07.059

Meinshausen, L.; Fremont, H.; Weide-Zaage, K.; Plano, B.  (2013): Electro- and Thermomigration-induced IMC Formation in SnAg3.0Cu0.5 Solder Joints on Nickel Gold Pads, Microelectronics Reliability, Volume 53, Issues 9–11, Pages 1575–1580
DOI: 10.1016/j.microrel.2013.07.038

Moujbani, A.; Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V.; Meinshausen, L. (2013): Dynamic Simulation of Migration Induced Failure Mechanism in Integrated Circuit Interconnects, Microelectronics Reliability, Volume 53, Issues 9–11, Pages 1365–1369
DOI: 10.1016/j.microrel.2013.07.097

2012

Ackermann, M.; Hein, V.; Weide-Zaage, K. (2012): A design for robust wide metal tracks, Microelectronics Reliability, Volume 52, Issues 9–10, Pages 2447–2451
DOI: 10.1016/j.microrel.2012.07.012

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2012): Simulation of the Influence of TiAl3 Layers on the Thermal-Electrical and Mechanical Behaviour of Al Metallizations, Microelectronics Reliability, Vol. 52, No 9-10, Pages 1987–1992
DOI: 10.1016/j.microrel.2012.06.129

Meinshausen, L.; Fremont, H.; Weide-Zaage, K. (2012): Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers, Microelectronics Reliability, Volume 52, Issues 9–10, Pages 1827–1832
DOI: 10.1016/j.microrel.2012.06.127

Meinshausen, L.; Weide-Zaage, K.; Fremont, H. (2012): Electro- and Thermomigration induced Failure Mechanisms in Package on Package, Microelectronics Reliability, Volume 52, Issue 12, Pages 2889–2906
DOI: 10.1016/j.microrel.2012.06.115

2011

Bauer, I.; Weide-Zaage, K.; Meinshausen, L. (2011): Influence of Air Gaps on the Thermal Electrical Mechanical Behavior of a Copper Metallization, Microelectronics Reliability, Volume 51, Issues 9–11, Pages 1587–1591
DOI: 10.1016/j.microrel.2011.07.011

Meinshausen, L.; Weide-Zaage, K.; Frémont, H. (2011): Migration induced material transport in Cu-Sn IMC and SnAgCu micro bumps, Microlectronics Reliability, Volume 51, Issues 9–11, Pages 1860–1864
DOI: 10.1016/j.microrel.2011.06.032

2009

Ciptokusumo, J.; Weide-Zaage, K.; Aubel, O. (2009): Investigation of Stress Distribution in Via Bottom of Cu-Via Structures with different Via form by means of Submodeling, Microelectronics Reliability, Vol. 49, No 9-11, Pages 1090-1095 (Best Paper Award)
DOI: 10.1016/j.microrel.2009.07.043

2008

Weide-Zaage, K. (2008): Simulation of Migration Effects in Solder Bumps, IEEE Transactions on Device and Materials Reliability, Volume 8, Issue 3, pp. 442-448
DOI: 10.1109/TDMR.2008.2002342

Weide-Zaage, K.; Kashanchi, F.; Aubel, O.  (2008): Simulation of Migration Effects in Nanoscaled Copper Metallizations, Microelectronics Reliability, Vol. 48, No 8-9, Pages 1398-1402
DOI: 10.1016/j.microrel.2008.06.025

Weide-Zaage, K.; Zhao, J.; Ciptokusumo, J. (2008): Determination of Migration Effects in Cu-Via Structures with Respect to Process Induced Stress, Microelectronics Reliability, Vol. 48, No 8-9, pp.1393–1397
DOI: 10.1016/j.microrel.2008.06.028

2007

Weide-Zaage, K.; Dalleau, D.; Danto, Y. (2007): Dynamic Void formation in a DD-copper-structure with different metallization geometry, Microelectronics Reliability, Vol. 47, No 2-3, pp.319-325.
DOI: 10.1016/j.microrel.2006.09.012

2005

Weide-Zaage, K.; Horaud, W.; Frémont, H. (2005): Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations, Microelectronic Reliability, Volume 45, Issues 9–11, Pages 1662–1667
DOI: 10.1016/j.microrel.2005.07.077

2004

Fremont, H.; Deletage, J.-Y.; Weide-Zaage, K.; Danto, Y. (2004): How to study delamination in plastic encapsulated devices, Microelectronics Reliability, Vol. 44, No 9-11, Pages 1311-1316
DOI: 10.1016/j.microrel.2004.07.015

2003

Dalleau, D.; Weide-Zaage, K.; Danto, Y. (2003): Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures, Microelectronics Reliability, Vol. 43, Pages 1821-1826.
DOI: 10.1016/S0026-2714(03)00310-X

Weide-Zaage, K.; Dalleau, D.; Yu, X. (2003): Stationary and dynamic analysis of failure locations and void formation in interconnects due to the different migration mechanisms, Materials Science in Semiconductor Processing 6, Volume 6, Issues 1–3, Pages 85-92
DOI: 10.1016/S1369-8001(03)00075-1

2001

Dalleau, D.; Weide-Zaage, K. (2001): Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to reliability Evaluation, Microelectronics Reliability, Volume 41, Issues 9–10, Pages 1625–1630
DOI: 10.1016/S0026-2714(01)00151-2

1999

Weide-Zaage, K.  (1999): Impact of FEM Simulation on Reliability Improvement of Packaging, Microelectronics Reliability, Volume 39, Number 6, Pages 1079-1088(10)
DOI: 10.1016/S0026-2714(99)00153-5

1997

Yu, X.; Weide, K. (1997): A study of the thermal-electrical- and mechanical influence on degradation in an aluminum-pad structure, Microelectronics Reliability, Volume 37, Issues 10–11, Pages 1545–1548
DOI: 10.1016/S0026-2714(97)00105-4

1996

Weide, K.; Menhorn, F.; Yu, X. (1996): Finite element investigations of mechanical stress in metallization structures, Microelectronics Reliability, Vol.36, No.11/12, Pages 1703-1706
DOI: 10.1109/ESREF.1996.888196
ISBN: 0-7803-3369-1

1995

Weide, K. ; Ullmann, J. ; Hasse, W. (1995): Model Calculations on a Bipolar Transistor Emitter Interconnection with Different Contact Shapes, Applied Surface Science, Volume 91, Issues 1–4, Pages 234–238
DOI: 10.1016/0169-4332(95)00124-7

Konferenzbeiträge

2018

Weide-Zaage, K. (2018): Simulation in the Context of Harsh Environment Conditions, Surface Mount Technology Association (SMTA), Electronics in Harsh Environments Conference, Amsterdam

Weide-Zaage, K.; Fremont, H.; Hein, V. (2018): “New Automotive” – Considerations for Reliability, Robustness and Resilience for CMOS Interconnects , Surface Mount Technology Association (SMTA), Pan Pacific Symposium
DOI: 10.23919/PanPacific.2018.8318993

Weide-Zaage, K.; Hein, V. (2018): Process, Geometry and Stack Related Reliability of Thick AlCu-Metal-Tracks, Surface Mount Technology Association (SMTA), Pan Pacific Symposium
DOI: 10.23919/PanPacific.2018.8319008

Weide-Zaage, K.; Tan, Y.; Hein, V. (2018): Process, Geometry and Stack Related Reliability of Thick AlCu-Metal-Tracks, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2017

Pohl, M.; Erstling, M.; Hein, V.; Weide-Zaage, K.; Chen, T. (2017): Differences in Reliability Effects for Thick Copper and Thick Aluminum Metallizations , IEEE International Reliability Physics Symposium (IRPS), Pages: MR-2.1 - MR-2.7
DOI: 10.1109/IRPS.2017.7936377

Sekar Sethu, R.; Hein, V.; Erstling, M.; Weide-Zaage, K. (2017): Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Pages: 1 - 6
DOI: 10.1109/EuroSimE.2017.7926226

Weide-Zaage, K.; Eichin, P.; Chen, C.; Zhao, Y.; Zhao, L.  (2017): COTS - Radiation Effects Approaches and Considerations, Surface Mount Technology Association (SMTA), Pan Pacific Symposium (Best Paper)

Weide-Zaage, K.; Frémont, H.; Guédon- Gracia, A.; Feng, Y.; Chen, A. (2017): Study of Corrosion in BGA solder balls, EUROCORR 2017, 20th International Corrosion Congress (ICC) and Process Safety Congress 2017

Weide-Zaage, K.; Fremont, H.; Hein, V. (2017): Packages and Interconnects under Harsh Conditions, Surface Mount Technology Association (SMTA), International Conference

2016

Guédon-Gracia, A.; Frémont, H.; Delétage, J.-Y.; Weide-Zaage, K. (2016): Corrosion study on BGA assemblies, Surface Mount Technology Association (SMTA), Pan Pacific Symposium

Hein, V.; Ackermann, M.; Erstling, M.; Liew, .; Weide-Zaage, K. (2016): A Design for a Highly Robust AlCu - W-Plug - Metallization Stack, Surface Mount Technology Association (SMTA), Pan Pacific Symposium

Liu, Y.; Weide-Zaage, K. (2016): Thermal-Electric-Mechanical Simulation of a Multilevel Metallization System, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2016.7463354

Weide-Zaage, K.; Xu, P. (2016): Simulation of Needle Bumps in a Package-on-Package Structure, IMAPS Nordic International Microelectronics And Packaging Society, Nordic Chapter

2015

Moujbani, A.; Weide-Zaage, K. ; Römer, B. ; Sabath, F. (2015): GEANT4 simulations in terms of radiation hardness of commercially available SRAM, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2015.7103106
ISBN: 978-1-4799-9949-1

Weide-Zaage, K.; Fremont, H. (2015): Possibilities of Corrosion Simulation in Microelectronic Packages and Assemblies, IMAPS Nordic International Microelectronics And Packaging Society, Nordic Chapter

Weide-Zaage, K.; Kludt, J.; Ackermann, M.; Hein, V.; Erstling M. (2015): Life Time Characterization for a Highly Robust Metallization, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2015.7103123

Weide-Zaage, K.; Moujbani, A.; Duchamp, G.; Dubois, T.; Verdier, F.; Fremont, H. (2015): How SI/EMC and reliability issues could interact together in embedded electronic systems?, IEEE International Symposium on Electromagnetic Compatibility and EMC Europe
DOI: 10.1109/ISEMC.2015.7256363
ISBN: 978-1-4799-6615-8

Weide-Zaage, K.; Moujbani, A.; Frémont, H. ; Guedon-Gracia, A.  (2015): Harsh marine environment – Toward corrosion simulation, Surface Mount Technology Association (SMTA), Pan Pacific Symposium

2014

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Kovacz, C.; Hein, V.  (2014): Reliability Performance of Different Layouts of Wide Metal Tracks, IEEE International Reliability Physics Symposium
DOI: 10.1109/IRPS.2014.6861153
ISBN: 978-1-4799-3317-4

Meinshausen, L.; Weide-Zaage, K.; Goldbeck, B.; Moujbani, A.; Kludt, J.; Frémont, H. (2014): Electromigration Reliability of Cylindrical Cu Pillar SnAg3.0Cu0.5 Bumps, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2014.6813775
ISBN: 978-1-4799-4791-1

Weide-Zaage, K.; Kludt, J.; Fremont, H.; Tetelin, A. (2014): Investigation of Chip-Package Interaction in 3D Integration, Surface Mount Technology Association (SMTA), Pan Pacific Symposium

Weide-Zaage, K.; Moujbani, A.; Kludt, J. (2014): Simulation in 3D Integration and TSV, IEEE 5th Latin American Symposium on Circuits and Systems
DOI: 10.1109/LASCAS.2014.6820324
ISBN: 978-1-4799-2506-3

2013

Weide-Zaage, K.; Kludt, J.; Meinshausen, L.; Farajzadeh, A. (2013): Synergiepotenzial von finite Elemente Simulationen bei der Optimierung des Entwurfsprozesses von Metallisierungen, VDE ITG, 24. GMM Workshop, Testmethoden und Zuverlässigkeit von Schaltungen und Systemen

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2013): Overlap Design for Higher Tungsten Via Robustness in AlCu Metallizations, IEEE, Integrated Reliability Workshop Final Report (IIRW) pp. 137-141
DOI: 10.1109/IIRW.2013.6804178
ISBN: 978-1-4799-0350-4

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2013): Deformation of Slotted Metal Tracks, IEEE, Integrated Reliability Workshop Final Report (IIRW), pp. 161-165
DOI: 10.1109/IIRW.2013.6804184
ISBN: 978-1-4799-0350-4

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2013): Characterization of a new designed octahedron slotted metal track by simulations, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2013.6529907
ISBN: 978-1-4673-6138-5

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V. (2013): Investigation of Thermomigration in Aluminum Metallization, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2013.6529896
ISBN: 978-1-4673-6138-5

Kludt, J.; Weide-Zaage, K.; Ackermann, M.; Hein, V.; Moujbani, A. (2013): Optimierung von Metallisierungsstrukturen mit Hilfe von thermisch-elektrisch-mechanischen FE-Simulationen, VDE ITG/GI/GMM-Fachtagung
ISBN: 978-3-8007-3539-6

Meinshausen, L.; Weide-Zaage, K.; Fremont, H. (2013): Influence of contact geometry variations on the life time distribution of IC packages during electromigration testing, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2013.6529895
ISBN: 978-1-4673-6138-5

Schlobohm, J.; Weide-Zaage, K.; Rongen, R.T.H.; Voogt, F.C.; Roucou, R. (2013): Simulation of CSP-Solder Bumps with a Plastic Core, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/EuroSimE.2013.6529979

Weide-Zaage, K.; Schlobohm, J.; Frémont, H.; Farajzadeh, A.; Kludt, J. (2013): 3D Integration a Thermal-Electrical-Mechanical-Reliability Study, Surface Mount Technology Association (SMTA), Pan Pacific Symposium

2012

Ackermann, M.; Hein, V.; Weide-Zaage, K. (2012): Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESimE.2012.6191800
ISBN: 978-1-4673-1512-8

Kludt, J.; Ciptokusumo, J.; Weide-Zaage, K. (2012): Influence of Liner Materials on the Mechanical Stress and Migration in a Copper Metallization, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESimE.2012.6191701
ISBN: 978-1-4673-1512-8

Meinshausen, L.; Weide-Zaage, K.; Fremont, H. (2012): Thermal Management for stackable package with stacked ICs, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESimE.2012.6191700
ISBN: 978-1-4673-1512-8

2011

Meinshausen, L.; Weide-Zaage, K.; Petzold, M. (2011): Electro- and Thermomigration in Microbump Interconnects for 3D Integration, IEEE, Electronic Components and Technology Conference (ECTC), pp. 1444 - 1451
DOI: 10.1109/ECTC.2011.5898701
ISBN: 978-1-61284-497-8

Weide-Zaage, K.; Meinshausen, L.; Fremont, H. (2011): Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts, IEEE Congress on Engineering and Technology (CET), Pages 376-382
ISBN: 978-1-61284-362-9

2010

Ciptokusumo, J.; Weide-Zaage, K.; Aubel, O. (2010): Principles for Simulation of Barrier Cracking due to high Stress, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESIME.2010.5464617
ISBN: 978-1-4244-7026-6

Ciptokusumo, J.; Weide-Zaage, K.; Aubel, O. (2010): Mechanical Characterization of Copper based Metallizations with different Via-Bottom Geometries, Physical and Failure Analysis of Integrated Circuits (IPFA), 17th IEEE International Symposium
DOI: 10.1109/IPFA.2010.5532227
ISBN: 978-1-4244-5596-6

Meinshausen, L.; Weide-Zaage, K. (2010): Exploration of Migration and Stress Effects in PoPs Considering Inhomogeneous Temperature Distribution, SMTA Surface Mount Technology Association, International Wafer-Level Packaging Conference (IWLPC)

Meinshausen, L.; Weide-Zaage, K.; Frémont, H. (2010): Underfill and mold compound influence on PoP ageing under high current and high temperature stresses, Electronic System-Integration Technology Conference (ESTC)
DOI: 10.1109/ESTC.2010.5642803
ISBN: 978-1-4244-8553-6

Meinshausen, L.; Weide-Zaage, K.; Frémont, H.; Feng, W. (2010): PoP: Prototyping by determination of matter transport effect, CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)
DOI: 10.1109/CPMTSYMPJ.2010.5679664
ISBN: 978-1-4244-7593-3

Meinshausen, L.; Weide-Zaage, K.; Frémont, H.; Feng, W. (2010): Virtual prototyping of PoP interconnections regarding electrically activated mechanisms, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESIME.2010.5464618
ISBN: 978-1-4244-7026-6

Weide-Zaage, K. (2010): Exemplified calculation of stress migration in a 90nm node via structure, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Keynote
DOI: 10.1109/ESIME.2010.5464542
ISBN: 978-1-4244-7026-6

Weide-Zaage, K.; Ciptokusumo, J., Aubel, O. (2010): Influence of the Activation Energy of the Different Migration Effects on Failure locations in Metallizations, AIP Conf. Proc. 1300, 85 (2010)
DOI: 10.1063/1.3527141

Weide-Zaage, K.; Frémont, H.; Meinshausen, L.; Feng, W. (2010): Characterisation of thermal-electrical and mechanical behaviour of PoP, Surface Mount Technology Association (SMTA), International

2009

Feng, W.; Weide-Zaage, K.; Verdier, F.; Plano, B.; Guedon-Gracia, A.; Fremont, H. (2009): Electrically driven matter transport effects in PoP interconnections, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESIME.2009.4938457
ISBN: 978-1-4244-4160-0

2008

Aubel, O.; Thierbach, S.; Seidel, R.; Freudenberg, B.; Meyer, M.A.; Feustel, F.; Poppe, J.; Nopper, M.; Preusse, A.; Zistl, C.; Weide-Zaage, K. (2008): Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-µm dimensions, IEEE International Reliability Physics Symposium (IRPS), Pages 675-676
DOI: 10.1109/RELPHY.2008.4558983
ISBN: 978-1-4244-2049-0

Weide-Zaage, K.; Fremont, H.; Wang, L. (2008): Simulation of Migration Effects in PoP, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESIME.2008.4525074
ISBN: 978-1-4244-2127-5

2006

Frémont, H.; Horaud, W.; Weide-Zaage, K. (2006): Measurements and FE-Simulations of Moisture Distribution in FR4 based Printed Circuit Boards, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
DOI: 10.1109/ESIME.2006.1643964
ISBN: 1-4244-0275-1

2005

Weide-Zaage, K.; Hein, V. (2005): Simulation of Mass Flux Divergence Distributions for an Evaluation of Commercial Test Structures with Tungsten-plugs, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Pages 367-372
DOI: 10.1109/ESIME.2005.1502827
ISBN: 0-7803-9062-8

2004

Nguyen, H.V. ; Salm, C. ; Krabbenborg, B. ; Weide-Zaage, K. ; Bisshop, J. ; Mouthaan, A.J.; Kuper, F.G. (2004): Effect of Thermal Gradients on the Electromigration Lifetime in Power Electronics, IEEE International Reliability Physics Symposium (IRPS), 2004, pp. 619-620
DOI: 10.1109/RELPHY.2004.1315418
ISBN: 0-7803-8315-X

Weide-Zaage, K.; Dalleau, D.; Danto, Y.; Fremont, H. (2004): Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Pages 367-372
DOI: 10.1109/ESIME.2004.1304065
ISBN: 0-7803-8420-2

2002

Dalleau, D.; Weide-Zaage, K. (2002): 3-D Time-depending Simulation of Voids formation in a SWEAT Metallization Structure, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2002, pp 310-315

2001

Weide-Zaage, K.; Keck, C. ; Willemen, J. (2001): Verifikation der Layout getreuen FE-Simulation eines MO-166 Gehäuses mittels elektrischer Messung und IR-Untersuchung, E.I.S.-Workshop, ITG Fachbericht „Entwurf Integrierter Schaltungen und Systeme“, pp. 219-222

Weide-Zaage, K.; Keck, Dalleau, D. (2001): Thermal Investigation of a Jedec MO-166 Package by finite element simulations, IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 113-116

Willemen, J.; Soppa, W.; Pieper, K.W.; Weide-Zaage, K.; Gärtner, R. (2001): Vergleich industrieller Entwicklungswerkzeuge für elektrothermische Schaltungssimulation, E.I.S.-Workshop, ITG Fachbericht „Entwurf Integrierter Schaltungen und Systeme“, pp. 143-146

2000

Dalleau, D.; Weide-Zaage, K. (2000): 3-D Time-Depending Electro- and Thermomigration Simulation of Metallization Structures, Adv. Met. Conf. (AMC 2000), Proc. Conf., Mater. Res. Soc, pp. 477-481

1999

Weide, K.; Gärtner, R. (1999): Infrarot-Untersuchung und Finite-Elemente-Simulation eines keramikgehäusten integrierten Spannungsreglers, Proc. Conf., 5. ITG/GMM-Diskussionssitzung, Analog 99, pp. 431-436

Weide, K.; Keck, C. (1999): Influence of Different Materials on the Thermal Behaviour of a CDIP-8 Ceramic Package, Proc. Conf. SPIE In-Line Methods and Monitors for Process and Yield Improvement, Santa Clara, pp. 157-163

1998

Weide, K.; Keck, C.; Yu, X.  (1998): Influence of the material properties on the thermal behavior of a package, Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, pp. 112-121
DOI: 10.1117/12.324388

Yu, X.; Weide, K. (1998): Investigations of mechanical stress migration in an aluminum test structure, Adv. Met. Conf. (AMC 1998), Proc. Conf. Sandhu, G.S.; Koerner, H.; et.al., Warrendale, PA, USA, USA: Mater. Res. Soc, pp. 469-473

Yu, X; Weide, K. (1998): Finite Element Analysis of Thermal-Mechanical Stress induced Failure in Interconnects, MRS Boston December 1998, MRS Proc.1999, pp 269-274.

1997

Yu, X.; Weide, K. (1997): Investigations of mechanical Stress and Electromigration in an aluminum meander structure, Proc. Conf. SPIE Vol. 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, Austin, pp. 160-166

1995

Weide, K.; Ullmann, J. (1995): Temperature and Current Density Distributions in Via Structures with Inhomogeneous Step Coverages, Proc. Conf. SPIE Vol. 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, Austin, pp. 145-155

Weide, K.; Yu, X.; Quintard, V. (1995): Simulation and Measurement of an Aluminum Meander Structure, Proc. 7th Int. Conf. Qual. Elec. Comp. & 6th Eur. Symp. Rel.Elec. Dev, pp. 241-246

1994

Claeys, W.; Dilhaire, S.; Lewis, D.; Quintard, V.; Phan, T.; Fenech, A.; Hasse, W.; Weide, K. (1994): Optical Current Density Probing at Interfaces in Bondings and Solder Joints: Investigation of Ageing Mechanisms

Weide, K.; Hasse, W. (1994): Electromigration Resistance of an ULSI Copper Via Structure Compared with a Tungsten and an Aluminum-Plug Via Structure with Barrier Layers, MRS Proc. of the Advanced Metallization for ULSI Applications Conf. p. 397

Weide, K.; Hasse, W. (1994): Failure Locations in Different Via Structures due to Electromigration, Proc. Int. Conf. 5th Eur. Symp. Rel. Elec. Dev., pp. 365-369

Weide, K.; Hasse, W. (1994): Prediction of the Failure Locations in Multilevel Metallizations due to Triple Points, Current Crowding an Temperature Gradients, roc. 11. International IEEE VLSI Multilevel Interconnection Conference, Pages 536-538.

1993

Weide, K.; Hasse, W. (1993): 3-Dimensional FEM-Simulations and Measurement of Via Structures, Proc. 6th Int. Conf. Qual. Elec. Comp. & 4th Eur. Symp. Rel. Elec. Dev., pp. 313-317

1992

Hasse, W.; Depta, D.; Weide, K. (1992): Thermal-Electrical Characterisation of SWEAT-Structures, Proc. Int. Conf. 3th Eur. Symp. Rel. Elec. Dev, Schwäbisch-Gemünd, pp. 371-375

Weide, K.; Hasse, W. (1992): 3-dimensional Simulations of Temperature and Current Density Distribution in a Via Structure

1991

Weide, K.; Bergmann, J.; Hasse, W.; Depta, D. (1991): Simulations of Current and Potential Distribution in a Via Structure and a Laser Formed Contact, Proc. 5th Int. Conf. Qual. Elec. Comp. & 2nd Eur. Symp. Rel. Elec. Dev., pp. 907-913

Sonstiges

2017

Weide-Zaage, K. (2017): Considerations Concerning Simulation of Radiation Effects in Chip and Packages, International Workshop on Reliability and Radiation Effects of Micro- and Nano-Electronic Devices 2017 (IWRRE-MNED2017) Invited Speaker

2014

Georgakos, G.; Helms, D.; Ackermann, M.; E. Bär, E. ; Bauer, K.; Bargfrede, J. ; Ecker, W.; Heidmann, N.; Hellwege, N.; Jancke, R.; Koser, E.; Kupke, W.; Melzner, H.; Meyer zu Bexten, V.; Pour Aryan, N.; Pronath, D.; Rott, R.; Vollertsen, R.; Weide-Zaage, K. (2014): RELY - Neue Methoden zum Entwurf von SoCs für kontrollierbare hohe Zuverlässigkeit für Anwendungen wie Transport, Medizin und Automatisierung, Auf dem Weg zu Systemen mit Selbstkontrolle: Höchste Zuverlässigkeit und längere Lebensdauer durch autarke Kompensation von Veränderungen während der Laufzeit, Newsletter edacentrum 01/02 2014

1999

Willemen, J.; Weide-Zaage, K.; Keck, C.; Diefenbach, J. (1999): Physikalische Modellierung der thermischen Eigenschaften von IC-Gehäusen, SSE-Bericht Parasitics