Influence of the material properties on the thermal behaviour of a package

verfasst von

Kirsten Weide, Christian Keck, Xiaoying Yu

Abstract

The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.

Organisationseinheit(en)

Fakultät für Elektrotechnik und Informatik

Typ

Aufsatz in Konferenzband

Seiten

112-121

Anzahl der Seiten

10

Publikationsdatum

28.08.1998

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Angewandte Informatik, Angewandte Mathematik, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1117/12.324388 (Zugang: Geschlossen)