Evaluation new corner stress relief structure layout for high robust metallization
- verfasst von
- V. Hein, J. Kludt, K. Weide-Zaage
- Abstract
For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction. Corner stress relief structures lower the influence of high thermo-mechanical stress. A high functional corner stress relief structure allows a more efficient chip design. In this work of corner stress relief structure is presented and an evaluation structure is shown which allows to prove the effectiveness of the stress relief.
- Organisationseinheit(en)
-
Laboratorium f. Informationstechnologie
- Externe Organisation(en)
-
X-FAB Silicon Foundries SE
- Typ
- Artikel
- Journal
- Microelectronics reliability
- Band
- 54
- Seiten
- 1977-1981
- Anzahl der Seiten
- 5
- ISSN
- 0026-2714
- Publikationsdatum
- 01.09.2014
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektronische, optische und magnetische Materialien, Atom- und Molekularphysik sowie Optik, Sicherheit, Risiko, Zuverlässigkeit und Qualität, Physik der kondensierten Materie, Oberflächen, Beschichtungen und Folien, Elektrotechnik und Elektronik
- Elektronische Version(en)
-
https://doi.org/10.1016/j.microrel.2014.07.039 (Zugang:
Geschlossen)
