How SI/EMC and reliability issues could interact together in embedded electronic systems?

verfasst von

Kirsten Weide-Zaage, Aymen Moujbani, Genevieve Duchamp, Tristan Dubois, Frederic Verdier, Helene Fremont

Abstract

The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.

Organisationseinheit(en)

Institut für Mikroelektronische Systeme

Externe Organisation(en)

Universite de Bordeaux

Typ

Aufsatz in Konferenzband

Seiten

1323-1328

Anzahl der Seiten

6

Publikationsdatum

10.09.2015

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Physik der kondensierten Materie, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/isemc.2015.7256363 (Zugang: Geschlossen)