Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

verfasst von: K. Hollstein, X. Yang, K. Weide-Zaage
Abstract: Quad-Flat-No-Lead (QFN) packages are electric components that are producing a substantial amount of heat during operation due to significant power loss. Resulting elevated temperatures can lead to critical damage of the chip and the package, which could cause a loss of functionality. Therefore, controlling the maximum temperature within the package is crucial. Using thermal vias embedded in the PCB underneath the QFN is a common concept to support the heat flow. In this paper a simulation approach is presented using 3D Finite-Element-Modelling to identify the impact of influencing parameters on the temperature distribution within the package. Therefore, the build-up of the model is explained and applied material properties are given. Results for the determined temperature distribution for a reference parameter set are presented. Geometrical parameters like the thickness and the area size of the thermal pads and the copper layers are varied. Furthermore, the via count and distribution has been changed and additional inner layers have been added in order to act as a heat sink. The impact of these variations on the resulting component temperature will be discussed in the analysis part. The paper will round up with a discussion of simulation results and an outlook for future work.
Organisationseinheit(en): Institut für Mikroelektronische Systeme
Typ: Artikel
Journal: Microelectronics reliability
Band: 120
ISSN: 0026-2714
Publikationsdatum: 05.2021
Publikationsstatus: Veröffentlicht
Peer-reviewed: Ja
ASJC Scopus Sachgebiete: Elektronische, optische und magnetische Materialien, Atom- und Molekularphysik sowie Optik, Physik der kondensierten Materie, Sicherheit, Risiko, Zuverlässigkeit und Qualität, Oberflächen, Beschichtungen und Folien, Elektrotechnik und Elektronik
Elektronische Version(en): https://doi.org/10.1016/j.microrel.2021.114118 (Zugang: Geschlossen)