A design for highly robust ALCU-W-PLUG-metallization stack

verfasst von

V. Hein, M. Ackermann, M. Erstling, J. Liew, K. Weide-Zaage

Abstract

Mission profiles for semiconductor applications are getting more and more challenging regarding electrical and thermo-mechanical robustness of metallization stacks. Effects, especially in thick metals, were investigated over the last years to find solutions for an improvement regarding both potential stressors. Some elements of a metallization were designed, investigated and simulated [1, 2, 3, 4 5]. But for an implementation in products it is necessary to develop a complete metallization stack. Therefore a support for layout tools is indispensable. This paper will explain the principles of a highly robust AlCu-metallization stack, the physics and failure mechanisms which are considered for some elements of such a metal stack and the design solution.

Organisationseinheit(en)

Institut für Mikroelektronische Systeme

Externe Organisation(en)

X-FAB Silicon Foundries SE

Typ

Aufsatz in Konferenzband

Publikationsdatum

07.03.2016

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik, Elektronische, optische und magnetische Materialien

Elektronische Version(en)

https://doi.org/10.1109/panpacific.2016.7428423 (Zugang: Geschlossen)