Electro- and thermomigration-induced IMC formation in SnAg _3.0Cu_0.5 solder joints on nickel gold pads

verfasst von

L. Meinshausen, H. Frémont, K. Weide-Zaage, B. Plano

Abstract

The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue during use of the component. As a consequence micro bumps (ø < 30 μm) completely consist of intermetallic compounds. Intermetallic compounds also enable electromigration induced void formation at the contacts surfaces of flip chip solder joints. It is essential for the fabrication of micro bumps and for the investigation of failure mechanisms in flip chip solder joints to characterize the migration-induced IMC formation. This study is based on the combination of electromigration, thermomigration and temperature storage tests on SnAg_3.0Cu_0.5 solder joints with NiAu pads. For the investigation of migration processes due to temperature gradients (thermomigration), alternating current tests for solder joints were developed. Finally, more accurate material parameters for the description of the migration-induced intermetallic compound formation are extracted, namely the activation energy (E_A), the diffusion constant (D₀), the effective charge of the moving ions (Z^*) and the heat of transport (Q^*).

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Externe Organisation(en)

Universite de Bordeaux

Typ

Artikel

Journal

Microelectronics reliability

Band

53

Seiten

1575-1580

Anzahl der Seiten

6

ISSN

0026-2714

Publikationsdatum

09.2013

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Atom- und Molekularphysik sowie Optik, Sicherheit, Risiko, Zuverlässigkeit und Qualität, Physik der kondensierten Materie, Oberflächen, Beschichtungen und Folien, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1016/j.microrel.2013.07.038 (Zugang: Unbekannt)