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Pohl M, Erstling M, Hein V, Weide-Zaage K, Chen T. Differences in reliability effects for thick copper and thick aluminium metallizations. in 2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. S. MR2.1-MR2.7. 7936377. (IEEE International Reliability Physics Symposium Proceedings). doi: 10.1109/irps.2017.7936377
Sethu RS, Hein V, Erstling M, Weide-Zaage K. Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks. in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7926226 doi: 10.1109/eurosime.2017.7926226
Weide-Zaage K, Payá-Vayá G. COTS - Harsh condition effects considerations from technology to user level. Advances in Science, Technology and Engineering Systems. 2017;2(3):1592-1598. doi: 10.25046/aj0203198
Weide-Zaage K, Eichin P, Chen C, Zhao Y, Zhao L. COTS-radiation effects approaches and considerations. in 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7859581. (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).
Weide-Zaage K. Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). Microelectronics reliability. 2017 Sep;76-77:6-12. doi: 10.1016/j.microrel.2017.07.026
Weide-Zaage K, Fremont H, Guedon-Gracia A, Feng Y, Chen A. Study of Corrosion in BGA solder balls. 2017. Beitrag in Joint European Corrosion Congress 2017, EUROCORR 2017 and 20th International Corrosion Congress and Process Safety Congress 2017, Prague, Tschechische Republik.
Chrzanowska-Jeske M, Weide-Zaage K. Preface. in Semiconductor Devices in Harsh Conditions. CRC Press. 2016. S. xiii-xvii doi: 10.1201/9781315368948
Guedon-Gracia A, Fremont H, Deletage JY, Weide-Zaage K. Corrosion study on BGA assemblies. in 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7428402 doi: 10.1109/panpacific.2016.7428402
Guédon-Gracia A, Frémont H, Plano B, Delétage JY, Weide-Zaage K. Effects of salt spray test on lead-free solder alloy. Microelectronics reliability. 2016 Sep 1;64:242-247. doi: 10.1016/j.microrel.2016.07.034
Hein V, Ackermann M, Erstling M, Liew J, Weide-Zaage K. A design for highly robust ALCU-W-PLUG-metallization stack. in 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7428423 doi: 10.1109/panpacific.2016.7428423
Hein V, Erstling M, Sethu RS, Weide-Zaage K, Bai T. Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectronics reliability. 2016 Sep 1;64:259-265. doi: 10.1016/j.microrel.2016.07.136
Liu Y, Weide-Zaage K. Thermal-electric-mechanical simulation of a multilevel metallization system. in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7463354 doi: 10.1109/eurosime.2016.7463354
Weide-Zaage K, Chrzanowska-Jeske M. Semiconductor devices in harsh conditions. CRC Press, 2016. 234 S. doi: 10.1201/9781315368948
Weide-Zaage K, Xu P. Simulation of needle bumps in a package-on-package structure. in Kutilainen J, Hrsg., IMAPS Nordic Annual Conference 2016 Proceedings. IMAPS-International Microelectronics and Packaging Society. 2016. (IMAPS Nordic Annual Conference 2016 Proceedings).
Meinshausen L, Weide-Zaage K, Frémont H. Dynamical IMC-growth calculation. Microelectronics reliability. 2015 Aug;55(9-10):1832-1837. doi: 10.1016/j.microrel.2015.06.052
Meinshausen L, Frémont H, Weide-Zaage K, Plano B. Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectronics reliability. 2015 Jan 1;55(1):192-200. doi: 10.1016/j.microrel.2014.09.030
Moujbani A, Weide-Zaage K, Romer B, Sabath F. GEANT4 simulations in terms of radiation hardness of commercially available SRAM. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7103106 doi: 10.1109/eurosime.2015.7103106
Nordin NIM, Said SM, Ramli R, Weide-Zaage K, Sabri MFM, Mamat A et al. Impact of aluminium addition on the corrosion behaviour of Sn-1.0Ag-0.5Cu lead-free solder. RSC Advances. 2015;5(120):99058-99064. doi: 10.1039/c5ra18453c, 10.1039/c5ra90108a
Sabri MFM, Nordin NIM, Said SM, Amin NAAM, Arof H, Jauhari I et al. Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectronics reliability. 2015 Aug;55(9-10):1882-1885. doi: 10.1016/j.microrel.2015.06.123
Weide-Zaage K, Moujbani A, Duchamp G, Dubois T, Verdier F, Fremont H. How SI/EMC and reliability issues could interact together in embedded electronic systems? in 2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. S. 1323-1328. 7256363. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/isemc.2015.7256363
