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Yu X, Weide K. Investigations of mechanical stress and electromigration in an aluminum meander structure. in Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III: 1 - 2 October 1997, Austin, Texas. Bellingham: SPIE. 1997. S. 160-166. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.284698
Weide K, Yu X, Menhorn F. Finite element investigations of mechanical stress in metallization structures. Microelectronics reliability. 1996;36(11-12 SPEC. ISS.):1703-1706. doi: 10.1016/0026-2714(96)00178-3
Weide K, Ullmann J, Hasse W. Model calculations on a bipolar transistor emitter interconnection with different contact shapes. Applied surface science. 1995 Okt 2;91(1-4):234-238. doi: 10.1016/0169-4332(95)00124-7
Weide K, Hasse W. 3-dimensional simulations of temperature and current density distribution in a via structure. in Annual Proceedings - Reliability Physics (Symposium). Publ by IEEE. 1992. S. 361-365. (Annual Proceedings - Reliability Physics (Symposium)). doi: 10.1109/relphy.1992.187670
