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Trumann E, Thieu GB, Vaya GP, Weide-Zaage K. Experimental Radiation Effect Characterization for Microelectronics. in 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc. 2025 doi: 10.23919/PanPacific65826.2025.10908937
Trumann E, Bahri AA, Thieu GB, Weide-Zaage K, von Wolff D, Bausen A et al. TCAD Simulation of Radiation Effects on 180 nm Logic Inverters. in Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers Inc. 2025. (Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025). doi: 10.1109/EuroSimE65125.2025.11006564
Weide-Zaage K, Lühring B. Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. in 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc. 2025 doi: 10.23919/PanPacific65826.2025.10908943
Hein V, Weide-Zaage K, Clausner A. The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications. in 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.23919/PanPacific60013.2024.10436520
Trumann E, Thieu GB, Schmechel J, Weide-Zaage K, Wolff DV, Bausen A et al. Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.1109/EuroSimE60745.2024.10491535
Weide-Zaage K. Dna Digital-storage: Advantages, Approach and Technical Implementation. in 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.23919/PanPacific60013.2024.10436508
Weide-Zaage K, Ma X, Poepsel F, Wurz M, Habicht D. Simulation of Corrosion Effects in Conductive Yarns. in 2024 International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles (E-Textiles). Berlin. 2024. S. 307-311 doi: 10.23919/e-textiles63767.2024.10914286
Weide-Zaage K, Mandala SJ, Trumann E, Paya-Vaya G, Wolff DV, Bausen A et al. Simulation of Different SRAM Cells under Neutron Radiation with GEANT4. in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc. 2024 doi: 10.1109/EuroSimE60745.2024.10491490
Weide-Zaage K, Huang Y. Simulation of Thermal–Electrical and Mechanical Behavior of Conductive Yarns. Engineering Proceedings. 2024 Jan 18;52(1):17. doi: 10.3390/engproc2023052017
Weide-Zaage K. Technical Implementation of DNA Data-Storage. in 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc. 2024. S. 111-112 doi: 10.23919/ICEP61562.2024.10535600
Thieu GB, Schmechel J, Weide-Zaage K, Schmidt K, Hagenah D, Paya-Vaya G. A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc. 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems). doi: 10.1109/EuroSimE56861.2023.10100757
Trumann E, Thieu GB, Schmechel J, Weide-Zaage K, Schmidt K, Hagenah D et al. Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. in Palumbo F, Keramidas G, Voros N, Diniz PC, Hrsg., Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Springer Science and Business Media Deutschland GmbH. 2023. S. 357-360. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)). doi: 10.1007/978-3-031-42921-7_24
Hollstein K, Entholzner D, Zhu G, Weide-Zaage K, Benstetter G. Developing a micro-thermography system for thermal characterization of LED packages. Microelectronic engineering. 2022 Feb 1;254:111694. Epub 2021 Dez 24. doi: 10.1016/j.mee.2021.111694
Weide-Zaage K, Paya-Vaya G, Schmidt K, Hagenah D. Investigation of FPGA and SRAM Cells under Radiation Exposure. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758864
Hein V, Weide-Zaage K. The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc. 2021. 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). doi: 10.1109/EuroSimE52062.2021.9410880
Hollstein K, Yang X, Weide-Zaage K. Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. Microelectronics reliability. 2021 Mai;120:114118. Epub 2021 Apr 17. doi: 10.1016/j.microrel.2021.114118
Hollstein K, Weide-Zaage K. Advances in Packaging for Emerging Technologies. in 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9059539 doi: 10.23919/panpacific48324.2020.9059539
Hollstein K, Yang L, Gao Y, Weide-Zaage K. Identification of influencing PCB design parameters on thermal performance of a QFN package. in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9152651 doi: 10.1109/eurosime48426.2020.9152651
Hollstein K, Weide-Zaage K. Silicon Die Bonding using a Photostructurable Adhesive Material. in 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9375868 doi: 10.23919/IWLPC52010.2020.9375868
Hein V, Weide-Zaage K, Yang X. Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8724562 doi: 10.1109/eurosime.2019.8724562
