Showing results 41 - 60 out of 106
Sabri MFM, Nordin NIM, Said SM, Amin NAAM, Arof H, Jauhari I et al. Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectronics reliability. 2015 Aug;55(9-10):1882-1885. doi: 10.1016/j.microrel.2015.06.123
Weide-Zaage K, Moujbani A, Duchamp G, Dubois T, Verdier F, Fremont H. How SI/EMC and reliability issues could interact together in embedded electronic systems? In 2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 1323-1328. 7256363. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/isemc.2015.7256363
Weide-Zaage K, Kludt, Ackermann M, Hein V, Erstling M. Life time characterization for a highly robust metallization. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7103123 doi: 10.1109/eurosime.2015.7103123
Frémont H, Kludt J, Wade M, Weide-Zaage K, Bord-Majek I, Duchamp G. Qualification procedure for moisture in embedded capacitors. Microelectronics reliability. 2014 Sept 1;54(9-10):2013-2016. doi: 10.1016/j.microrel.2014.07.117
Hein V, Kludt J, Weide-Zaage K. Evaluation new corner stress relief structure layout for high robust metallization. Microelectronics reliability. 2014 Sept 1;54(9-10):1977-1981. doi: 10.1016/j.microrel.2014.07.039
Kludt J, Weide-Zaage K, Ackermann M, Hein V, Kovács C. Degradation behavior in upstream/downstream via test structures. Microelectronics reliability. 2014 Sept 1;54(9-10):1724-1728. doi: 10.1016/j.microrel.2014.07.042
Kludt J, Weide-Zaage K, Ackermann M, Kovacs C, Hein V. Reliability performance of different layouts of wide metal tracks. In 2014 IEEE International Reliability Physics Symposium, IRPS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. IT.4.1-IT.4.4. 6861153. (IEEE International Reliability Physics Symposium Proceedings). doi: 10.1109/irps.2014.6861153
Meinshausen L, Weide-Zaage K, Goldbeck B, Moujbani A, Kludt J, Fremont H. Electromigration reliability of cylindrical Cu pillar SnAg 3.0Cu0.5 bumps. In 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. IEEE Computer Society. 2014. 6813775. (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014). doi: 10.1109/eurosime.2014.6813775
Rongen R, Roucou R, Vd Wel PJ, Voogt F, Swartjes F, Weide-Zaage K. Reliability of wafer level chip scale packages. Microelectronics reliability. 2014 Sept 1;54(9-10):1988-1994. doi: 10.1016/j.microrel.2014.07.012
Weide-Zaage K, Schlobohm J, Rongen RTH, Voogt FC, Roucou R. Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectronics reliability. 2014;54(6-7):1206-1211. doi: 10.1016/j.microrel.2014.02.021
Weide-Zaage K, Moujbani A, Kludt J. Simulation in 3D integration and TSV. In 2014 IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014 - Conference Proceedings. IEEE Computer Society. 2014. 6820324 doi: 10.1109/lascas.2014.6820324
Kludt J, Weide-Zaage K, Ackermann M, Hein V. Characterization of a new designed octahedron slotted metal track by simulations. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529907. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013). doi: 10.1109/EuroSimE.2013.6529907
Kludt J, Weide-Zaage K, Ackermann M, Hein V. Deformation of octahedron slotted metal tracks. In 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc. 2013. p. 161-165. 6804184. (IEEE International Integrated Reliability Workshop Final Report). doi: 10.1109/IIRW.2013.6804184
Kludt J, Weide-Zaage K, Ackermann M, Hein V. Dynamic simulation of octahedron slotted metal structures. Microelectronics reliability. 2013 Sept;53(9-11):1606-1610. doi: 10.1016/j.microrel.2013.07.059
Kludt J, Weide-Zaage K, Ackermann M, Hein V. Investigation of temperature gradients with regard to thermomigration in aluminium metallizations. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529896. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013). doi: 10.1109/EuroSimE.2013.6529896
Kludt J, Weide-Zaage K, Ackermann M, Hein V. Overlap design for higher tungsten via robustness in AlCu metallizations. In 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc. 2013. p. 137-141. 6804178. (IEEE International Integrated Reliability Workshop Final Report). doi: 10.1109/IIRW.2013.6804178
Meinshausen L, Frémont H, Weide-Zaage K, Plano B. Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads. Microelectronics reliability. 2013 Sept;53(9-11):1575-1580. doi: 10.1016/j.microrel.2013.07.038
Meinshausen L, Weide-Zaage K, Frémont H. Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529895. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013). doi: 10.1109/EuroSimE.2013.6529895
Moujbani A, Kludt J, Weide-Zaage K, Ackermann M, Hein V, Meinshausen L. Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectronics reliability. 2013 Sept;53(9-11):1365-1369. doi: 10.1016/j.microrel.2013.07.097
Schlobohm J, Weide-Zaage K, Rongen R, Voogt F, Roucou R. Simulation and measurement of the solder bumps with a plastic core. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529979. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013). doi: 10.1109/EuroSimE.2013.6529979
