Finite element investigations of mechanical stress in metallization structures

authored by

K. Weide, X. Yu, F. Menhorn

Abstract

For different double layer metallization structures the thermal-electrical-mechanical stress due to the mismatch of thermal expansion coefficients and elastic moduli was calculated by finite element analysis. A quantitative comparison between a conventional structure with small aluminum step coverage as well as an aluminum plug, a tungsten filled via structure and a structure with a barrier layer was done. The influence of applied current density, metallization length and passivation thickness and material was investigated for the tungsten filled via structure.

Organisation(s)

Laboratorium f. Informationstechnologie

Type

Article

Journal

Microelectronics reliability

Volume

36

Pages

1703-1706

No. of pages

4

ISSN

0026-2714

Publication date

1996

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/0026-2714(96)00178-3 (Access: Unknown)