Publikationen des Instituts für Mikroelektronische Systeme

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2025


Formally Verifying Analog Neural Networks with Device Mismatch Variations. / Abu-Haeyeh, Yasmine; Bartelsmeier, Thomas; Ladner, Tobias et al.
2025 Design, Automation and Test in Europe Conference, DATE 2025 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2025. (Proceedings -Design, Automation and Test in Europe, DATE).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

A Novel Chaining-Based Indirect Addressing Mode in a Vertical Vector Processor. / Gesper, Sven; Köhler, Daniel; Thieu, Gia Bao et al.
Embedded Computer Systems: Architectures, Modeling, and Simulation - 24th International Conference, SAMOS 2024, Proceedings. Hrsg. / Luigi Carro; Francesco Regazzoni; Christian Pilato. Springer Science and Business Media Deutschland GmbH, 2025. S. 167-182 (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 15226 LNCS).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

A Practical Survey on Static Task Scheduling Optimization Approaches for Heterogeneous Architectures. / Hollmann, Jonas; Lüders, Matthias; Arndt, Jakob et al.
Euro-Par 2024: Parallel Processing Workshops - Euro-Par 2024 International Workshops, Proceedings. Hrsg. / Silvina Caino-Lores; Demetris Zeinalipour; Thaleia Dimitra Doudali; David E. Singh; Gracia Ester Martín Garzón; Leonel Sousa; Diego Andrade; Tommaso Cucinotta; Donato D'Ambrosio; Patrick Diehl; Manuel F. Dolz; Admela Jukan; Raffaele Montella; Matteo Nardelli; Marta Garcia-Gasulla; Sarah Neuwirth. Band Conference proceedings 2025. S. 425–437 (Lecture Notes in Computer Science; Band 15385 LNCS).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandBeitrag in Buch/SammelwerkForschungPeer-Review

SmartHeaP- A High-level Programmable and Customized Hearing Aid System on Chip Integrated in a Research Hearing Aid Prototype. / Karrenbauer, Jens; Schonewald, Sven; Klein, Simon et al.
in: IEEE Transactions on Biomedical Circuits and Systems, Jahrgang 19, Nr. 3, 06.2025, S. 669-685.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Miniaturized 3D Glass Package for High-Efficiency and High-Power Density 48V DC-DC Converters. / Koch, Jannik; Winkler, Joseph; Wicht, Bernhard et al.
2025 IEEE International Workshop on Integrated Power Packaging (IWIPP). 2025. Aufl. 2025. (Proceedings of the IEEE International Workshop on Integrated Power Packaging, IWIPP).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Radar Object Detection on a Vector Processor Using Sparse Convolutional Neural Networks. / Köhler, Daniel; Meinl, Frank; Blume, Holger.
Embedded Computer Systems: Architectures, Modeling, and Simulation - 24th International Conference, SAMOS 2024, Proceedings. Hrsg. / Luigi Carro; Francesco Regazzoni; Christian Pilato. Springer Science and Business Media Deutschland GmbH, 2025. S. 138-154 (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 15226 LNCS).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Hardware und Software vereint: Innovation durch Co-Design. / Lüders, Matthias; Weddige, Sousa; Blume, Holger Christoph.
in: ti! Technologie-Informationen, 03.04.2025.

Publikation: Beitrag in FachzeitschriftArtikelTransfer

Fiber deviation and optimized toolpath strategies in melt electrowriting of tubular scaffolds. / Neuhaus, Benno; Loewner, Sebastian; Heymann, Henrik et al.
in: Materials & Design, Jahrgang 254, 114147, 06.2025.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Fehlerschutzmechanismen für verteilte Systeme aus COTS FPGAs in Weltraumanwendungen. / Oberschulte, Tim.
Hannover: Institutionelles Repositorium Leibniz Universität Hannover, 2025. 157 S.

Publikation: Qualifikations-/StudienabschlussarbeitDissertation

RRNS Arith Lib – An Open-Source Redundant Residue Number System Arithmetic VHDL Library. / Oberschulte, Tim; Sievers, Enno; Blume, Holger.
2025. 49 Postersitzung präsentiert bei 2025 ACM/SIGDA International Symposium on Field Programmable Gate Arrays, Monterey, California, USA / Vereinigte Staaten.

Publikation: KonferenzbeitragPosterForschungPeer-Review

Modified Parabolic Synthesis for Hardware-Oriented Approximation of Unary Functions. / Schneider, Viktor J.; Schönewald, Sven Johannes; Blume, Holger Christoph.
2025 IEEE International Symposium on Circuits and Systems (ISCAS). 2025.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Towards real-time LiDAR processing on RISC-V-based ASIPs: fast trigonometric approximations via parabolic synthesis. / Schneider, Viktor J.; Schönewald, Sven; Blume, Holger.
Real-time Processing of Image, Depth, and Video Information 2025. Hrsg. / Gian Domenico Licciardo; Matthias F. Carlsohn; Viktor J. Schneider. 2025. 1352603 (Proceedings of SPIE - The International Society for Optical Engineering; Band 13526).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

A Passive Switched-Capacitor-Based Multimode Amplifier with a Logarithmic Conformity Error of 0.75% from -25 to 200°C. / Siemssen, Hendrik; Nowosielski, Rochus; Borchardt, Holger et al.
2025 IEEE International Solid-State Circuits Conference, ISSCC 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (2025 IEEE International Solid-State Circuits Conference (ISSCC)).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

HOOP: A Scalable Hybrid DC-DC Converter Ring for High-Performance Computing. / Tong, Zhiguo; Yu, Zhewen; Huang, Junwei et al.
2025 IEEE International Solid-State Circuits Conference, ISSCC 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Experimental Radiation Effect Characterization for Microelectronics. / Trumann, Eike; Thieu, Gia Bao; Vaya, Guillermo Pava et al.
2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc., 2025.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

TCAD Simulation of Radiation Effects on 180 nm Logic Inverters. / Trumann, Eike; Bahri, Amen Allah; Thieu, Gia Bao et al.
Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers Inc., 2025.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Systems and algorithms for the mobile application of functional sports tests. / Webering, Fritz.
Hannover: Leibniz Universität Hannover, 2025. 147 S.

Publikation: Qualifikations-/StudienabschlussarbeitDissertation

Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. / Weide-Zaage, Kirsten; Lühring, Beatrice.
2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc., 2025.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Survey of Components and Topologies for High-Efficiency and High-Power Density 48V DC-DC Converters. / Winkler, Joseph; Deneke, Niklas; Wicht, Bernhard.
APEC 2025 - 14th Annual IEEE Applied Power Electronics Conference and Exposition. Institute of Electrical and Electronics Engineers Inc., 2025. S. 848-853 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review


2024


An Intelligent and Efficient Workflow for Path-Oriented 3D Bioprinting of Tubular Scaffolds. / Baroth, Timo; Loewner, Sebastian; Heymann, Henrik et al.
in: 3D Printing and Additive Manufacturing, Jahrgang 11, Nr. 1, 15.02.2024, S. 323-332.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review