apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
30167 Hannover
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Publikationsliste
Showing results 21 - 40 out of 106
2018
Process, geometry and stack related reliability of thick ALCU-metal-tracks. / Weide-Zaage, Kirsten; Hein, Verena.
2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-7.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Thick AlCu-metal reliability characterization. / Weide-Zaage, Kirsten; Tan, Yuqi; Hein, Verena.
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-4.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2017
Differences in reliability effects for thick copper and thick aluminium metallizations. / Pohl, Martin; Erstling, Marco; Hein, Verena et al.
2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. MR2.1-MR2.7 7936377 (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks. / Sethu, Raj Sekar; Hein, Verena; Erstling, Marco et al.
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7926226.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
COTS - Harsh condition effects considerations from technology to user level. / Weide-Zaage, Kirsten; Payá-Vayá, Guillermo.
In: Advances in Science, Technology and Engineering Systems, Vol. 2, No. 3, 2017, p. 1592-1598.Research output: Contribution to journal › Article › Research › peer review
COTS-radiation effects approaches and considerations. / Weide-Zaage, Kirsten; Eichin, Philemon; Chen, Chen et al.
2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7859581 (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). / Weide-Zaage, Kirsten.
In: Microelectronics reliability, Vol. 76-77, 09.2017, p. 6-12.Research output: Contribution to journal › Article › Research › peer review
Study of Corrosion in BGA solder balls. / Weide-Zaage, Kirsten; Fremont, Hélène; Guedon-Gracia, Alexandrine et al.
2017. Paper presented at Joint European Corrosion Congress 2017, EUROCORR 2017 and 20th International Corrosion Congress and Process Safety Congress 2017, Prague, Czech Republic.Research output: Contribution to conference › Paper › Research › peer review
2016
Preface. / Chrzanowska-Jeske, Małgorzata; Weide-Zaage, Kirsten.
Semiconductor Devices in Harsh Conditions. CRC Press, 2016. p. xiii-xvii.Research output: Chapter in book/report/conference proceeding › Foreword/postscript › Research › peer review
Corrosion study on BGA assemblies. / Guedon-Gracia, A.; Fremont, H.; Deletage, J. Y. et al.
2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7428402.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Effects of salt spray test on lead-free solder alloy. / Guédon-Gracia, A.; Frémont, H.; Plano, B. et al.
In: Microelectronics reliability, Vol. 64, 01.09.2016, p. 242-247.Research output: Contribution to journal › Article › Research › peer review
A design for highly robust ALCU-W-PLUG-metallization stack. / Hein, V.; Ackermann, M.; Erstling, M. et al.
2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7428423.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. / Hein, Verena; Erstling, Marco; Sethu, Raj Sekar et al.
In: Microelectronics reliability, Vol. 64, 01.09.2016, p. 259-265.Research output: Contribution to journal › Article › Research › peer review
Thermal-electric-mechanical simulation of a multilevel metallization system. / Liu, Yanpeng; Weide-Zaage, Kirsten.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7463354.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Semiconductor devices in harsh conditions. / Weide-Zaage, Kirsten; Chrzanowska-Jeske, Małgorzata.
CRC Press, 2016. 234 p.Research output: Book/Report › Monograph › Research › peer review
Simulation of needle bumps in a package-on-package structure. / Weide-Zaage, Kirsten; Xu, Peiyu.
IMAPS Nordic Annual Conference 2016 Proceedings. ed. / Jarkko Kutilainen. IMAPS-International Microelectronics and Packaging Society, 2016. (IMAPS Nordic Annual Conference 2016 Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2015
Dynamical IMC-growth calculation. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
In: Microelectronics reliability, Vol. 55, No. 9-10, 08.2015, p. 1832-1837.Research output: Contribution to journal › Article › Research › peer review
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. / Meinshausen, L.; Frémont, H.; Weide-Zaage, K. et al.
In: Microelectronics reliability, Vol. 55, No. 1, 01.01.2015, p. 192-200.Research output: Contribution to journal › Article › Research › peer review
GEANT4 simulations in terms of radiation hardness of commercially available SRAM. / Moujbani, Aymen; Weide-Zaage, Kirsten; Romer, Berthold et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7103106.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Impact of aluminium addition on the corrosion behaviour of Sn-1.0Ag-0.5Cu lead-free solder. / Nordin, N. I.M.; Said, S. M.; Ramli, R. et al.
In: RSC Advances, Vol. 5, No. 120, 2015, p. 99058-99064.Research output: Contribution to journal › Article › Research › peer review
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Forschungsprojekte
Systementwurf
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Simulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungSimulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.09.2013-31.01.2015
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Component reliability in high temperature automotive applications (Rely)Thermisch-elektrisch-mechanische Simulation, Degradationsmodellierung auf Device-LevelLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.05.2011-30.04.2013
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Untersuchung zur Simulation von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer SystemeIm Zuge der Miniaturisierung moderner integrierter Schaltungen verändert sich die Strahlenhärte der Systeme und Komponenten. Daraus resultierend ist es notwendig, die die Strahlenhärte beeinflussenden Mechanismen im Halbleiter zu bestimmen.Led by: PD Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2015Duration: 01.02.2015-31.12.2017
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Entwurf und Test von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer System unter Hochtemperatur-UmgebungenDie Eignung von Bauelementen und Komponenten für die Entwicklung strahlungsrobuster autonomer Systeme, die insbesondere mit einer langen Verweildauer in einer strahlenbelasteten Umgebung ihren Einsatz finden, hängt stark von der Dimensionierung sowie dem Herstellungsprozess der Bauelemente und Komponenten ab. Simulationen können helfen, die physikalischen Zusammenhänge besser zu verstehen. Im geplanten Projekt ist der Entwurf und Test von Halbleiterkomponenten unter erschwerten Umwelt-Bedingungen wie Strahlung und Temperatur geplant.Led by: apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2021Duration: 1.9.2019- 31.8.2022
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