Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
30167 Hannover
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Publikationsliste
Showing results 61 - 80 out of 111
2013
Overlap design for higher tungsten via robustness in AlCu metallizations. / Kludt, Jorg; Weide-Zaage, Kirsten; Ackermann, Markus et al.
2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., 2013. p. 137-141 6804178 (IEEE International Integrated Reliability Workshop Final Report).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads. / Meinshausen, L.; Frémont, H.; Weide-Zaage, K. et al.
In: Microelectronics reliability, Vol. 53, No. 9-11, 09.2013, p. 1575-1580.Research output: Contribution to journal › Article › Research › peer review
Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529895 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. / Moujbani, Aymen; Kludt, Jörg; Weide-Zaage, Kirsten et al.
In: Microelectronics reliability, Vol. 53, No. 9-11, 09.2013, p. 1365-1369.Research output: Contribution to journal › Article › Research › peer review
Simulation and measurement of the solder bumps with a plastic core. / Schlobohm, J.; Weide-Zaage, K.; Rongen, R. et al.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529979 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2012
A design for robust wide metal tracks. / Ackermann, M.; Hein, V.; Kovács, C. et al.
In: Microelectronics reliability, Vol. 52, No. 9-10, 09.2012, p. 2447-2451.Research output: Contribution to journal › Article › Research › peer review
Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. / Ackermann, M.; Hein, V.; Weide-Zaage, K.
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191800 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. / Kludt, Jörg; Ciptokusumo, J.; Weide-Zaage, K.
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191701 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation of the influence of TiAl 3 layers on the thermal-electrical and mechanical behaviour of Al metallizations. / Kludt, J.; Weide-Zaage, K.; Ackermann, M. et al.
In: Microelectronics reliability, Vol. 52, No. 9-10, 09.2012, p. 1987-1992.Research output: Contribution to journal › Article › Research › peer review
Electro- and thermo-migration induced failure mechanisms in Package on Package. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
In: Microelectronics reliability, Vol. 52, No. 12, 12.2012, p. 2889-2906.Research output: Contribution to journal › Review article › Research › peer review
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. / Meinshausen, L.; Frémont, H.; Weide-Zaage, K.
In: Microelectronics reliability, Vol. 52, No. 9-10, 09.2012, p. 1827-1832.Research output: Contribution to journal › Article › Research › peer review
Thermal management for stackable packages with stacked ICs. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191700 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2011
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. / Bauer, Irina; Weide-Zaage, Kirsten; Meinshausen, Lutz.
In: Microelectronics reliability, Vol. 51, No. 9-11, 09.2011, p. 1587-1591.Research output: Contribution to journal › Article › Research › peer review
Electro- and thermomigration in micro bump interconnects for 3D integration. / Meinshausen, L.; Weide-Zaage, K.; Petzold, M.
2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 1444-1451 5898701 (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
In: Microelectronics reliability, Vol. 51, No. 9-11, 09.2011, p. 1860-1864.Research output: Contribution to journal › Article › Research › peer review
2010
Mechanical characterization of copper based metallizations with different via-bottom geometries. / Ciptokusumo, Johar; Weide-Zaage, Kirsten; Aubel, Oliver.
IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 2010. 5532227 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Principles for simulation of barrier cracking due to high stress. / Ciptokusumo, Johar; Weide-Zaage, Kirsten; Aubel, Oliver.
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464617 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
PoP prototyping by determination of matter transport effects. / Meinshausen, L.; Weide-Zaage, K.; Feng, W. et al.
2010 IEEE CPMT Symposium Japan, ICSJ10. 2010. 5679664 (2010 IEEE CPMT Symposium Japan, ICSJ10).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Underfill and mold compound influence on PoP aging under high current and high temperature stress. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 2010. 5642803 (Electronics System Integration Technology Conference, ESTC 2010 - Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Virtual prototyping of PoP interconnections regarding electrically activated mechanisms. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H. et al.
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464618 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Showing results 61 - 80 out of 111
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Forschungsprojekte
Systementwurf
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Simulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungSimulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.09.2013-31.01.2015
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Component reliability in high temperature automotive applications (Rely)Thermisch-elektrisch-mechanische Simulation, Degradationsmodellierung auf Device-LevelLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.05.2011-30.04.2013
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Untersuchung zur Simulation von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer SystemeIm Zuge der Miniaturisierung moderner integrierter Schaltungen verändert sich die Strahlenhärte der Systeme und Komponenten. Daraus resultierend ist es notwendig, die die Strahlenhärte beeinflussenden Mechanismen im Halbleiter zu bestimmen.Led by: PD Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2015Duration: 01.02.2015-31.12.2017
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Entwurf und Test von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer System unter Hochtemperatur-UmgebungenDie Eignung von Bauelementen und Komponenten für die Entwicklung strahlungsrobuster autonomer Systeme, die insbesondere mit einer langen Verweildauer in einer strahlenbelasteten Umgebung ihren Einsatz finden, hängt stark von der Dimensionierung sowie dem Herstellungsprozess der Bauelemente und Komponenten ab. Simulationen können helfen, die physikalischen Zusammenhänge besser zu verstehen. Im geplanten Projekt ist der Entwurf und Test von Halbleiterkomponenten unter erschwerten Umwelt-Bedingungen wie Strahlung und Temperatur geplant.Led by: apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2021Duration: 1.9.2019- 31.8.2022
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